APA Style

Lau, J, H. (2000). Low-Cost Flip Chip Technologies: For Dca, Wlcsp, And Pbga Assemblies . USA: The McGraw-Hill Companies, Inc..

MLA Style

Lau, John, H.. "Low-Cost Flip Chip Technologies: For Dca, Wlcsp, And Pbga Assemblies". USA: The McGraw-Hill Companies, Inc., 2000. Text.