Low-Cost Flip Chip Technologies: For Dca, Wlcsp, And Pbga Assemblies | Perpustakaan Universitas Islam Indonesia

No image available for this title

Text

Low-Cost Flip Chip Technologies: For Dca, Wlcsp, And Pbga Assemblies

Lau, John H. - Personal Name;

Description Not Available

Availability

#

Lantai UG Sisi Utara Direktorat Perpustakaan UII 621.381 Lau L 1 1

5201003122001

Available

Detail Information

Series Title: -
Call Number: 621.381 Lau L
Publisher: USA : The McGraw-Hill Companies, Inc.., 2000
Collation: xxii; 585p,; 24 cm.
Language
ISBN/ISSN: 0-07-135141-8
Classification: 621.381
Content Type: -
Media Type: -
Carrier Type: -
Edition: -
Subject(s): Microelectronic Packaging,Multichip Modules
Specific Detail Info: -
Statement of Responsibility: -

Other version/related

No other version available

File Attachment

No Data

Comments

You must be logged in to post a comment

© Hak Cipta 2021 - Universitas Islam Indonesia - Direktorat Perpustakaan Universitas Islam Indonesia | Pengelolaan Situs Web | Pernyataan Sangkalan | Powered By Slims